Synopsys Collaborates with TSMC to Drive the Next Wave of AI and Multi-Die Innovation

AI-Driven EDA and Broad IP Solutions Enable Differentiated Designs on TSMC Advanced Processes and SoIC Technologies

Key Highlights 

SUNNYVALE, Calif., Sept. 24, 2025 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) announced today its ongoing close collaboration with TSMC to deliver multi-die solutions, encompassing advanced EDA and IP products, that support TSMC's leading-edge processes and packaging technologies, driving innovation in AI chip and multi-die design. The 3DIC Compiler exploration-to-signoff platform and IP, tuned for 3D packaging, along with the company's partnership with TSMC on design enablement has resulted in multiple customer tape-outs.

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