Smartkem Announces Preliminary Joint Development Agreement with Manz Asia for Advanced Computer and AI Chip Packaging Solutions

Joint Development Agreement builds on ongoing collaboration with Manz Asia

MANCHESTER, England, July 9, 2025 /PRNewswire/ -- Smartkem (Nasdaq: SMTK), which is seeking to change the world of electronics with a new class of transistor technology, today announced that it has entered into a preliminary Joint Development Agreement (JDA) with Manz Asia, a pioneer in advanced packaging equipment for the semiconductor industry, which, when finalized will focus on the co-development of next generation dielectric ink solutions for advanced packaging manufacturing, particularly tailored for AI chip packaging applications.

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