Valens Semiconductor to Showcase High-Performance Connectivity Innovations for AI Applications at Embedded World 2025

HOD HASHARON, Israel, March 10, 2025 /PRNewswire/ -- Valens Semiconductor (NYSE: VLN), a leader in high-performance connectivity, today announced that it will display its innovative connectivity technology required for various AI applications at Embedded World 2025. Valens will display demonstrations in collaboration with a variety of companies, all offering the machine vision market cutting-edge solutions based on Valens' standard-compliant chipsets. These companies include Leopard Imaging, Acroname, Airy3D, Cherry Embedded Solutions, D3 Embedded, Fabrimex, Framos, Intel, RGo Robotics, and Teledyne e2v.

Read more at prnewswire.com