Lightwave Logic Announces Issuance of U.S. Patent for Breakthrough Chip-Scale Packaging Technique to Enable Foundry-Level Packaging of Polymer Modulators
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Last update: Dec 12, 2022
Company Secures Patent Issuance for Previously Announced Patent Application for Ability to Fabricate Polymer Modulators Using Chip-Scale Techniques, Enabling Simplified High-Volume Manufacturing through Foundry-Level Packaging
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