FRA:BSI • NL0012866412
The current stock price of BSI.DE is 155.9 EUR. Today BSI.DE is down by -17.27%. In the past month the price decreased by -5.6%. In the past year, price increased by 53.75%.
ChartMill assigns a technical rating of 9 / 10 to BSI.DE. When comparing the yearly performance of all stocks, BSI.DE is one of the better performing stocks in the market, outperforming 91.88% of all stocks.
ChartMill assigns a fundamental rating of 5 / 10 to BSI.DE. BSI.DE has an average financial health and profitability rating.
On February 19, 2026 BSI.DE reported an EPS of 0.54 and a revenue of 166.35M. The company beat EPS expectations (8.44% surprise) and beat revenue expectations (1.68% surprise).
28 analysts have analysed BSI.DE and the average price target is 189.24 EUR. This implies a price increase of 21.39% is expected in the next year compared to the current price of 155.9.
For the next year, analysts expect an EPS growth of 102.43% and a revenue growth 44.06% for BSI.DE
Over the last trailing twelve months BSI.DE reported a non-GAAP Earnings per Share(EPS) of 1.66. The EPS decreased by -27.83% compared to the year before.
| Industry Rank | Sector Rank | ||
|---|---|---|---|
| PM (TTM) | 25.56% | ||
| ROA | 13.84% | ||
| ROE | 40.95% | ||
| Debt/Equity | 1.49 |
| Symbol | Company Name | Technical Rating | Fundamental Rating | FPE | Market Cap |
|---|---|---|---|---|---|
| 1ASML | ASML HOLDING NV | 43.81 | 464.693B | ||
| ASML | ASML HOLDING NV | 41.97 | 460.346B | ||
| ASME | ASML HOLDING NV | 41.94 | 460.113B | ||
| AVS | ASM INTERNATIONAL NV | 40.8 | 36.149B | ||
| ASM | ASM INTERNATIONAL NV | 40.92 | 35.34B | ||
| BESI | BE SEMICONDUCTOR INDUSTRIES | 46.51 | 15.309B | ||
| TPRO | TECHNOPROBE SPA | 59.02 | 10.42B | ||
| AIXA | AIXTRON SE | 43.6 | 3.301B | ||
| WAF | SILTRONIC AG | N/A | 1.544B | ||
| SOH1 | S.O.I.T.E.C. | 65.43 | 1.508B | ||
| SOI | S.O.I.T.E.C. | 65.48 | 1.468B | ||
| SMHN | SUSS MICROTEC SE | 26.77 | 1.055B |
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BE Semiconductor Industries NV engages in the development, manufacturing, marketing, sales, and service of semiconductor assembly equipment for the global semiconductor and electronics industries. The company is headquartered in Duiven, Gelderland and currently employs 1,840 full-time employees. The firm is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. The company operates through three segments: Die Attach, Packaging and Plating. The company develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The firm offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.
BE SEMICONDUCTOR INDUSTRIES
Ratio 6
Duiven GELDERLAND NL
Employees: 1820
Phone: 31263194500
BE Semiconductor Industries NV engages in the development, manufacturing, marketing, sales, and service of semiconductor assembly equipment for the global semiconductor and electronics industries. The company is headquartered in Duiven, Gelderland and currently employs 1,840 full-time employees. The firm is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. The company operates through three segments: Die Attach, Packaging and Plating. The company develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The firm offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.
The current stock price of BSI.DE is 155.9 EUR. The price decreased by -17.27% in the last trading session.
BE SEMICONDUCTOR INDUSTRIES (BSI.DE) has a dividend yield of 0.84%. The yearly dividend amount is currently 2.18.
BSI.DE has a ChartMill Technical rating of 9 out of 10 and a ChartMill Fundamental rating of 5 out of 10.
BE SEMICONDUCTOR INDUSTRIES (BSI.DE) operates in the Information Technology sector and the Semiconductors & Semiconductor Equipment industry.
The PE ratio for BE SEMICONDUCTOR INDUSTRIES (BSI.DE) is 93.92. This is based on the reported non-GAAP earnings per share of 1.66 and the current share price of 155.9 EUR.