SANTA CLARA, Calif., March 10, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced a long-term collaboration agreement with SK hynix Inc. to accelerate the development and deployment of next-generation DRAM and high-bandwidth memory (HBM) essential for AI and high-performance computing. Engineers from both companies will work side-by-side at Applied’s EPIC Center in Silicon Valley to advance innovation in materials, process integration and 3D advanced packaging as memory architectures move beyond current production nodes.
Read more at globenewswire.comApplied Materials and SK hynix Announce Long-Term R&D Partnership to Accelerate AI Memory Innovation at EPIC Center in Silicon Valley
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